| Conductive Foam NK DECF-P, a highly resilient Nickel - Copper polyurethane foam. NK DECF-P is ideal for applications that require conformity with excellent cavity-to-cavity EMI shielding, superior conductivity at low compression forces.
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| Application |
Structure |
| To solve the electronic problems such as EMI,
EDS and mechanical problems, conductive foam
is applying to mobile phones, notebook computer,
and LCD monitor etc. |
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| Conductive PU Coating |
| Conductive Foam |
| Mesh |
| Conductive Adhesive |
| Release Liner |
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| Item |
Unit |
Test Method |
NK-DECF-P |
| Standard thickness |
MM |
ASTM D374 |
0.3mm to 6mm (+/- 0.3) |
| Standard size |
MM |
Measurement Tape |
300MMX50M |
| Adhesive Strength |
180 peel * gf/25mm |
26°C *60% R.H. |
> 1,000 |
| SUS304 plate 30 min, 300mm/min |
|
| Holding Strength |
sec |
PET film(25µm),40°C, 500g |
> 3,600 |
| Volume Conductivity |
Ω/sq |
inch/0.5Kgf |
< 0.2 |
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| Material |
Conductive PU Coating |
Polymer resin : Polyurethane |
| Conductive Foam |
Polyurethane foam (Copper and Nickel Plated) |
| Mesh |
Polyester woven mesh with Copper and Nickel Plated |
| Conductive Adhesive |
Conductive one side adhesive |
| Release Liner |
CP paper avg 70µm |
| Conductive adhesive resin composition |
Acrylic ester poly copolymer + Nickel powder |
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