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Copper Foil with Conductive Adhesive
CPCA07 is typically used for applications requiring excellent electrical conductivity from the application substrate through the adhesive to the foil backing. Common uses include grounding and EMI shielding in equipment, components, shielded rooms, etc. The copper foil backing is solderable and resists oxidation and discoloration.
Product Code
Layer no.1 Copper Anti Corrosion Treated avg 35µm
Layer no.2 Conductive Adhesive Acrylic Conductive Adhesive one side avg 30µm
Layer no.3 Release paper CP paper avg 70µm
Physical Properties
Total thickness µm 65 ±10
Width mm 300
Adhesive strength 180 peel 26°C*60%R.H. SUS304 Plate 30 min,300mm/min gf/25mm More than 800
Holding Strength (sec) PET film 25µm, 40°C, 500g   More than 3,600
Surface resitivity (0.5Kgf) Ω/sq inch less than 0.1
Volume resitivity (0.5Kgf) Ω/sq inch less than 0.1
Temperature Range °C  - 10 ~ 80
RoHS Compliant
Cadmium (Cd) ICP-AES PASS
Hexavalent Chromium (Cr6) UV-Vis PASS
Mercury (Hg) ICP-AES PASS
Compounds PBDEs GC/MS PASS
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