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Heat Sink Zecol Thermal Conductive Adhesive Tape
Structure
  Thermally Conductive Acrylic Adhesive
  Glass Fiber
  Thermally Conductive Acrylic Adhesive
  Release Liner
Application
- Bonding heat sink for PCB and IC package
- Mounting of IC, GPU, heat pipe and heat sink during assembly
- Other heat transferring applications in electronic and electric appliances
Base material   Glass Fiber  
Color   White  
Thickness mm 0.100±10%  
Thermally Conductive Acrylic Adhesive mm 0.150±10% 1mm/1,000mm Thickness Dial Gage/Mitutoyo 7313
Total Thickness mm 0.250±10%  
Tensile Strength kg/10mm 0.16  
Elongation % 550  
Shear Adhesion kg/cm 2 3.5  
Adhesive Power(180° Peel, gf/25mm)   1,000 PET Film (25 µm)/minSUS 304 Plate
Holding Power sec More than 3,600 PET Film (25 µm), 40℃, 500g
Dielectric Breakdown kV 4.0  
Thermal impedance coefficient °C-in2/W 0.7 ASTM D5470
Thermal Conductivity W/m·K 1.0 ASTM D5470
Notice
- The tape is stored in a clean and dust-free place with the temperature of 20~25°C without direct sunlight.
- Do not put anything with heavy weight above tape.
- To obtain optimum adhesion, the bonding surface must be clean, dry and well unified.
 
 
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