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THM Hankook Thermal Conductive Interface Pad / Gap Filler
Features Application


- Interface between various heat generating components and heat sinks or rails
- Isolate electrical components and power sources from heat sink
- Military, Medical devices and Industrail controls
- FPDs, Notebook PC and Mobile phones
Features Application


- Between IC and heat sink or chassis & power components of various packages
- Between other heat generating devices & chassis
- DRAM memory modules & Power supply
- CD / DVD ROM & HDD Cooling
SILICONE THERMAL PAD NK-THM-1.5W NK-THM-1.8W NK-THM-3W NK-THM-5W NK-THM-7W Test Method
Electrically & Thermal Properties
Dielectric Breakdown V Vac >10,000 >10,000 >6,000 >5,000 >5,000 ASTM D149
Dielectric Constant 1000Hz 5.5 5.5 6.5 7 7.5 ASTM D150
Volume Resistivity Ω,㎝ 10 14 10 14 10 11 10 11 10 11 ASTM D257
Shielding Effectiveness dB >80 >70 >40 >20 Min. 50 ASTM D4935
Thermal Conductivity W/m•k 1.5 1.8 3.0 5.0 7.0 ASTM D5470
Physical Properties
Reinforcement Non Carrier or Fiberglass Non Carrier
Thickness mm 0.2 ~ 5 0.5 ~ 5 ASTM D374
Color Dark grey, light grey, grey, yellow, pink, Ivory etc.
Adhesive with adhesive or without adhesive
Specific Gravity g/㎤ 2.50 (+/-0.2) 2.70 (+/-0.2) 2.95 (+/-0.2) 3.10 (+/-0.2) 3.20 (+/-0.2) ASTM D792
Hardness Shore 00 50(±10) 50(±10) 60(±10) 65(±10) 65(±10) ASTM D2240
Temperature Range - 60 ~ + 200 - 60 ~ + 200 - 60 ~ + 200 - 60 ~ + 200 - 60 ~ + 200
Flame Resistance V-0 V-0 V-0 V-0 V-0 UL94
Inherent surface: Non tacky, one side or both sides
Ceramic Heat Sink
Ceramic Heat-Sink Provides Innovative Thermal Management
Benefit:
Excellent Thermal Management – Long Life, cost save, light weight
Product Code Width Height Length (mm)
NK212 22 1 22
NK232 22 3 22
NK414 40 1 40
NK434 40 3 40
 
 
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